Siemens introduces validation program to accelerate autonomous vehicle development

PAVE360 provides a comprehensive environment for multi-supplier collaboration across the automotive ecosystem for the development of next-generation automotive chips. PAVE360 also extends digital twin simulation beyond processors to include automotive hardware and software sub-systems, full vehicle models, a fusion of sensor data, traffic flows and even the simulation of smart cities through which self-driving cars will ultimately travel.

“PAVE360 from Siemens delivers a comprehensive program to support the deep, cross-ecosystem collaboration necessary for our customers to develop powerful custom silicon and software solutions to power the autonomous vehicles revolution," said Ravi Subramanian, vice president, and general manager of the IC Verification Solutions Division of Mentor, a Siemens business. 

PAVE360 enables capabilities for full, closed-loop validation of the sensing/decision-making/actuating paradigm at the heart of all automated driving systems. This principle hinges on rigorous pre-silicon validation of deterministic (rules-based) and non-deterministic (AI-based) approaches to safe self-driving in the context of the full digital twin. 

Democratizing Automotive IC Design and Development

As advances in processing continue to play an increasingly prominent role in automotive evolution, carmakers are turning to custom silicon designs to deliver the “just right” blends of cost, power, performance and advanced features necessary to enable an autonomous future. 

With PAVE360, chip design can be democratized, enabling carmakers, chipmakers, tier one suppliers, software houses and other vendors to collaborate on the development and customization of extraordinarily complex silicon devices for autonomous vehicles. PAVE360 delivers a robust platform for this collaboration, helping to speed chip design and software validation, and enabling the creation of model-specific silicon for the first-generation of self-driving cars. 

PAVE360 establishes a design-simulation-emulation solution that scales from individual blocks of a system-on-chip’s (SoC’s) IP, to hardware and software on the SoCs, to vehicle subsystems, and up through deployment of vehicles in smart cities – a true “chip-to-city” approach based on the increasing digitalization of the automotive industry. 

"PAVE360 from Siemens enables everyone in the automotive value chain to develop custom SoCs, optimized for the performance, power, safety, thermal and form factor requirements of driver assisted and fully automated vehicles in a completely virtual environment," said Jim McGregor, principal analyst at TIRIAS Research. “PAVE360 is part of a complete, closed-loop simulation solution from Siemens that allows designers to test everything from silicon development to full vehicle validation."